Published On: September 30, 2020

Dirac Launches Spatial Audio Solution Integration with Bluetooth DSPs

Published On: September 30, 2020
Last Updated on: March 9, 2022
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Dirac Launches Spatial Audio Solution Integration with Bluetooth DSPs

The spatial audio solution can be integrated into Bluetooth chipsets for headphone optimization.

Dirac Launches Spatial Audio Solution Integration with Bluetooth DSPs

By Author: Home Theater Review
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Dirac has announced that its spatial audio processing can now be integrated directly into the DSP chips of Bluetooth headphones from any manufacturers who choose to do so. Using Dirac's patented Dynamic HRTF technology, manufacturers can create headphones that provide an immersive listening experience comparable to home theater systems from standard stereo content. Klipsch and RHA have already begun integrating Dirac's spatial audio solution into the chipsets of unreleased wireless headphones, with more manufacturers expected to do the same soon.

Additional Resources
Will Apple's AirPods Pro Start a 3D Audio Revolution? at HomeTheaterReview.com
Dirac Live Bass Management Module Comes Home at CEDIA Expo 2019 at HomeTheaterReview.com
AudioControl and Dirac Team Up to Tackle Bass at HomeTheaterReview.com

Keep reading for more information about Dirac's announcement:

Today we announce that our award-winning spatial audio solution is now available for direct integration into the digital signal processors (DSP) of Bluetooth wireless headphones. It is compatible with chipsets from Qualcomm, BES, and MediaTek and allows headphone manufacturers to deliver spatial audio to consumers independent of playback devices or media players.

By enabling spatial audio natively in wireless headphones, Dirac is ensuring headphone manufacturers continue to differentiate their offerings in a highly competitive market, and consumers can enjoy immersive, high-quality sound from standard stereo content regardless of the playback device or media player - for elevated music listening, gaming, and movie watching experiences.

"The integration of spatial audio onto the headphone DSP is an industry-first and a major leap in the evolution of audio technology," said Peter Cedmer, Director of Product Management, Headphones. "Traditionally, digital sound optimization technology for headphones has had to run on smartphones, media player, or other playback systems. Dirac's ability to integrate its algorithms directly into wireless headphone chipsets opens up a new world of innovation and differentiation."

Dirac's spatial audio solution for wireless headphones comes with two key features: spatial audio and speaker optimization. The spatial audio feature is enabled by Dirac's patented Dynamic HRTF technology, creating an immersive stereo listening experience from standard stereo content similar to what is achievable with a home theater system, without requiring specifically encoded spatial audio content.

The speaker optimization feature is delivered by Dirac's patented magnitude response correction and impulse response correction, digitally enhancing headphone performance without an expensive hardware upgrade. The result is maximized sound quality - with clearer, balanced sound with richer, tighter bass.

"While TWS earphones miniaturize, and the size of the speaker drivers are further reduced, consumers continue to expect great sound quality from these increasingly small devices," continued Cedmer. "Our solution empowers wireless headphones to stand out in a fiercely competitive market by delivering superior sound quality from smaller form factors than ever before. The speaker optimization feature can even be offered alone, without the spatial audio feature, to OEMs that focus solely on maximizing headphone sound quality."

The solution is enabled through Dirac's world-class tuning system and team of tuning experts to ensure manufacturers achieve their signature sound with high accuracy and consistency across product models in reduced time. Headphone manufacturers can easily integrate the Dirac solution into chipsets from leading Bluetooth DSP vendors, such as Mediatek, BES, and Qualcomm.

"We've already had two leading companies -- Klipsch and RHA -- integrate Dirac into soon-to-be-announced headphones, and we're in active talks with several more," concluded Cedmer. "As Dirac becomes standard in more headphones, OEMs will have more opportunity to competitively differentiate from one another and deliver their customer-base an increasingly impressive sound experience." 

For more information on Dirac, visit www.dirac.com

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